The heat sink substrate heat sink substrate is formed by combining a metal substrate and a heat sink in an ordinary metal base copper clad plate, and the metal heat sink substrate may be made of aluminum or copper material, and may be formed into various heat dissipating fin forms. In order to significantly increase the surface area of ​​the heat sink, while saving the heat sink material, the heat dissipation effect is further improved. This project adopts aluminum radiator substrate and directly adopts aluminum profile structure to reduce cost.
Insulating and thermally conductive layer Insulation and heat conduction layer is the core structure layer of high-power LED heatsink-based copper-clad printed circuit laminate, which mainly functions as bonding, insulation and heat conduction. The material must have good insulation properties, good thermal conductivity, and good bonding properties. The better the thermal conductivity of the insulating layer, the more favorable the diffusion of heat generated by the LED power device during operation, the more favorable it is to reduce the operating temperature of the LED device, thereby increasing the power load of the module, reducing the volume, extending the life, and increasing the power. Output and other purposes.
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